A premium, self-leveling one-component adhesive and sealant based on silane-modified polymer (SMP) technology. This advanced formulation ensures excellent adhesion to a wide range of substrates, outstanding weather resistance, and easy application – making it the ideal solution for demanding construction, renovation projects as also as encapsulation for electronic parts.
Designed for precise seam sealing and permanently elastic joints in both interior and exterior applications.
Thanks to its outstanding flow properties, it is also perfectly suited as a potting compound in the electronics industry, providing reliable protection and insulation for sensitive components.
Our innovative protective material can be easily applied by casting cures into a soft-elastic, durable layer upon contact with ambient humidity. It offers outstanding UV resistance and is completely odorless.
Free from solvents, isocyanates, silicones, and PVC – for safe and environmentally friendly use.
Surface preparation:
Surfaces must be clean, dry and free from grease, oil,
dust and contaminants.
Curing conditions:
The optimal processing window is between 20 and 30 °C and 40 to 70% relative humidity. Below 15 °C, the curing times are significantly longer.
The elastic properties of the adhesive can only be achieved if the adhesive is applied in sufficient thickness. This depends on the level of mechanical stress.
Storage conditions:
The product must be stored at temperatures between 10°C and 30°C.
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